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DTSTART;TZID=America/New_York:20260403T113000
DTEND;TZID=America/New_York:20260403T123000
DTSTAMP:20260505T071043
CREATED:20260326T184109Z
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UID:56049-1775215800-1775219400@coe.northeastern.edu
SUMMARY:JOINT SPECIAL COLLOQUIUM: AI-Optimized Advanced Packaging for Next-Generation Computing
DESCRIPTION:JOINT SPECIAL COLLOQUIUM \nCollege of Science\, College of Engineering & Quantum Materials and Sensing Institute (QMSI)\nAI-Optimized Advanced Packaging for Next-Generation Computing\nDr. Rabindra Das\nMIT Lincoln Laboratory \nFriday\, Apr 3\, 2026; 11:30am to 12:30pm\nHosts: Prof. Arun Bansil & Prof. Kin Chung Fong \nVenue: Elliott Hall – Room 130C\, 147 S. Bedford St\, Burlington\, MA\nRemote: MS Teams Link \nAbstract \nThe rapid growth of artificial intelligence (AI)\, high-performance computing (HPC)\, and data-intensive sensing systems is creating unprecedented demands for computational capability\, energy efficiency\, and system integration. Applications such as autonomous sensing platforms\, satellites\, and unmanned aerial and underwater vehicles increasingly require powerful onboard processing to analyze large volumes of data in real time. As conventional transistor scaling slows\, advanced packaging and heterogeneous integration are emerging as critical technologies for enabling next-generation computing systems. \nThis talk presents a research vision for AI-optimized advanced packaging\, where artificial intelligence techniques—particularly decision-tree-based optimization—are used to guide the design and fabrication of complex heterogeneous microsystems. AI-driven approaches enable optimization of substrate fabrication\, chiplet placement\, interconnect routing\, power delivery\, and thermal management across multi-chip systems. A central focus is the development of heterogeneous System-on-Wafer (SoW) architectures\, integrating tens to hundreds of chiplets on a single wafer substrate to achieve extraordinary computing density. A case study on superconducting wafer-scale multi-chip modules with ultra-fine-pitch micro-bump interconnects demonstrates how advanced packaging can address key challenges in scalability\, interconnect density\, and system performance for future AI\, HPC\, and quantum computing platforms. \nBiography \nRabindra N. Das\, Ph.D. is a Member of the Technical Staff in the Advanced Technology Division at MIT Lincoln Laboratory\, Lexington\, MA. Previously\, he served as a Principal Engineer at Endicott Interconnect Technologies (formerly IBM Endicott). Dr. Das has more than 23 years of experience in microelectronics packaging and heterogeneous integration\, spanning high-performance computing\, medical electronics\, and superconducting quantum hardware systems. He has authored 135+ technical publications and holds 51 patents in microelectronics packaging technologies. He has been recognized for four consecutive years (2020–2023) in Stanford University’s list of the world’s top 2% most-cited scientists.
URL:https://coe.northeastern.edu/event/joint-special-colloquium-ai-optimized-advanced-packaging-for-next-generation-computing/
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BEGIN:VEVENT
DTSTART;TZID=America/New_York:20260401T113000
DTEND;TZID=America/New_York:20260401T123000
DTSTAMP:20260505T071043
CREATED:20260326T183643Z
LAST-MODIFIED:20260326T183643Z
UID:56047-1775043000-1775046600@coe.northeastern.edu
SUMMARY:JOINT SPECIAL COLLOQUIUM: Scalable Quantum Applications: Synergies in Control\, Learning and Co-design
DESCRIPTION:JOINT SPECIAL COLLOQUIUM\nCollege of Science\, College of Engineering & Quantum Materials and Sensing Institute (QMSI)\nScalable Quantum Applications: Synergies in Control\, Learning and Co-design\nDr. Hong-Ye Hu\nHarvard University \nWednesday\, Apr 1\, 2026; 11:30am to 12:30pm\nHosts: Prof. Arun Bansil & Prof. Kin Chung Fong \nVenue: Elliott Hall – Room 130C\, 147 S. Bedford St\, Burlington\, MA\nRemote: MS Teams Link \nAbstract \nThe rapid advancement of quantum science and technology has ushered in a new era where analog simulators can now control thousands of qubits and digital processors are approaching break-even points for error correction. However\, bridging the gap to large-scale quantum applications demands synergistic innovation across hardware-aware control\, rigorous learning protocols\, and algorithm-hardware co-design. In this talk\, I will demonstrate the utility of this full-stack approach\, focusing first on the untapped potential of analog platforms. I will show that globally controlled systems can exhibit universal quantum dynamics even without local addressability. \nBy leveraging a novel direct optimal control technique\, we experimentally realized effective three-body interactions in a globally driven Rydberg atom array\, a critical resource for simulating exotic quantum phases. As system sizes scale\, the ability to efficiently learn and benchmark devices also becomes critical. Traditional methods like quantum process tomography are exponentially expensive\, while scalable alternatives\, such as Hamiltonian learning\, typically rely on structural ansätze that induce bias. To address this\, we introduced the first Hamiltonian learning algorithm that functions without any structural ansatz while retaining optimal experimental scaling. This paradigm shift enables the rigorous\, in-situ benchmarking of large-scale devices\, allowing us to characterize unknown interactions and noise sources without preconceptions. Finally\, I will conclude with perspectives on the future of scalable quantum systems\, specifically focusing on AI-assisted quantum control and fault-tolerant architectural designs. \nBiography \nHong-Ye Hu is a Harvard Quantum Initiative (HQI) Fellow working at the intersection of quantum information theory\, quantum many body physics and machine learning. His research focuses on developing scalable methods for quantum control\, verification\, and learning in complex quantum systems\, with applications to quantum simulation\, early fault-tolerant quantum computation and quantum error correction\, as well as modern deep-learning approaches for quantum physics.
URL:https://coe.northeastern.edu/event/joint-special-colloquium-scalable-quantum-applications-synergies-in-control-learning-and-co-design/
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BEGIN:VEVENT
DTSTART;TZID=America/New_York:20260330T113000
DTEND;TZID=America/New_York:20260330T123000
DTSTAMP:20260505T071043
CREATED:20260326T182534Z
LAST-MODIFIED:20260326T184433Z
UID:56044-1774870200-1774873800@coe.northeastern.edu
SUMMARY:JOINT SPECIAL COLLOQUIUM: New Degrees of Freedom for Quantum Hardware
DESCRIPTION:JOINT SPECIAL COLLOQUIUM\nCollege of Science\, College of Engineering & Quantum Materials and Sensing Institute (QMSI)\nNew Degrees of Freedom for Quantum Hardware\nDr. Haoxin Zhou\nUniversity of California\, Berkeley \nMonday\, Mar 30\, 2026; 11:30am to 12:30p.m.\nHosts: Prof. Arun Bansil & Prof. Kin Chung Fong \nVenue: Elliott Hall – Room 130C\, 147 S. Bedford St\, Burlington\, MA\nRemote: MS Teams Link\nAbstract \nRealizing the full potential of quantum information processing requires overcoming fundamental limitations in qubit coherence\, connectivity\, and scalability. One promising pathway is to harness new quantum degrees of freedom in emerging materials to build hybrid quantum hardware. Advances in condensed matter physics have revealed rich macroscopic quantum phenomena in solids\, arising from collective dynamics of electrons and lattice vibrations. Harnessing these excitations opens new opportunities for storing\, transmitting\, and manipulating quantum information. \nIn this talk\, I will explore how such phenomena emerge and how they can be integrated into quantum devices. I will first briefly illustrate how strong electronic interactions generate macroscopic quantum coherence\, for example in graphene van der Waals heterostructures. I will then present recent work revealing interface-induced piezoelectric coupling in superconducting circuits\, which introduces a new qubit decoherence channel while also enabling coherent coupling to acoustic phonons. Finally\, I will outline future directions for hybrid quantum platforms integrating phonons and other collective excitations\, and discuss how artificial intelligence may assist the control and optimization of these complex architectures.\nBiography \nHaoxin Zhou is a postdoctoral researcher at the University of California\, Berkeley\, working with Prof. Alp Sipahigil. His research lies at the intersection of circuit quantum electrodynamics and condensed matter physics\, exploring hybrid quantum systems that couple superconducting qubits to acoustic phonons. He received his Ph.D. in Physics from the University of California\, Santa Barbara\, in 2021\, where he worked with Prof. Andrea Young on correlated electronic phases in graphene Van der Waals heterostructures utilizing cryogenic electrical measurements. He received his B.S. in Physics from the University of Science and Technology of China in 2015.
URL:https://coe.northeastern.edu/event/joint-special-colloquium-new-degrees-of-freedom-for-quantum-hardware/
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BEGIN:VEVENT
DTSTART;TZID=America/New_York:20240202T110000
DTEND;TZID=America/New_York:20240202T120000
DTSTAMP:20260505T071043
CREATED:20240131T203252Z
LAST-MODIFIED:20240131T203252Z
UID:41852-1706871600-1706875200@coe.northeastern.edu
SUMMARY:An Interdisciplinary Approach to Building up Quantum Science and Technology
DESCRIPTION:The College of Science\, College of Engineering\, and Quantum Materials and Sensing Institute (QMSI) invite you to a joint special colloquium. \nAn Interdisciplinary Approach to Building up Quantum Science and Technology \nFriday\, 2nd Feb\, 2024; 11:00 a.m. to 12:00 p.m.\nHosts: Arun Bansil and Matteo Rinaldi \nZoom meeting \nQuantum science and technology hold the promise to deepen our understanding of the universe and deliver groundbreaking technical innovations. The opportunity also poses a grand challenge to today’s scientists and engineers because initializing\, controlling\, manipulating\, and measuring the quantum information while maintaining the coherence and entanglement can be very difficult. Therefore\, successfully achieving breakthroughs would require an interdisciplinary approach that leverages resources from various disciplines to forge new pathways which cannot be defined by a singular field of study. \nIn this talk\, I will share my interdisciplinary adventure through quantum material and quantum device landscapes. We will start from the study of fundamental characteristics of Dirac and topological materials\, and then focus on the material physics that we can exploit to invent single-photon detectors. We will further explore how to utilize the novel properties of the two-dimensional van der Waals materials to miniaturize qubits and develop quantum-noise-limited amplifiers. And finally\, we will turn around to apply what we learn from quantum sensing to study the pairing symmetry of novel superconductivities\, including the topological Weyl superconductors. We will end by elucidating how to harness the kinetic inductance of these novel superconductors for future flight-missions to explore planetary science and the origins of life. \n\nDr. Kin Chung Fong is a Senior Scientist at RTX BBN (Cambridge\, MA) and a Research Associate at Physics Department\, Harvard University. His interdisciplinary research focuses on quantum materials and their applications. KC also studies how to exploit these quantum sensors to investigate the hydrodynamic physics in the nearly perfect fluid\, reveal the pairing symmetry of novel superconductors\, search for the dark matter axion\, and explore the origins of life from the early universe. In addition to his substantial publications in high-impact peer-reviewed journals\, he is also a prolific inventor with >10 granted patents. His innovation has been recognized with the Raytheon Intelligence & Space Innovators Award in 2020 and 2022. KC received his PhD from Ohio State University and served his postdocs at Max Planck Institute for Quantum Optics and Caltech.
URL:https://coe.northeastern.edu/event/an-interdisciplinary-approach-to-building-up-quantum-science-and-technology/
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