AI Chips Are Getting Hotter. A Microfluidics Breakthrough Goes Straight to the Silicon To Cool up to Three Times Better.
Electrical engineering alumna Judy Priest was featured in the Microsoft News article “AI chips are getting hotter. A microfluidics breakthrough goes straight to the silicon to cool up to three times better.” Priest is the Corporate Vice President and Chief Technical Officer of Cloud Operations and Innovation at Microsoft.
She highlighted that the new microfluidics cooling technology will “allow for more power-dense designs that will enable more features that customers care about and give better performance in a smaller amount of space.” She also emphasized the importance of testing reliability after proving the technology worked.