Busnaina Awarded Patent
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Mechanical and Industrial Engineering Professor Ahmed Busnaina was awarded a patent for designing a “3D Nanoscale Circuit Interconnect & Method of Assembly by Dielectrophoresis”.
Professor Busnaina has obtained numerous awards and honors in his time in the industry, as well as being a widely published author. He also occupies a position of leadership at the Northeastern University Center for High-rate nanomanufacturing.