Busnaina Awarded Patent

Mechanical and Industrial Engineering Professor Ahmed Busnaina was awarded a patent for designing a “3D Nanoscale Circuit Interconnect & Method of Assembly by Dielectrophoresis”.

Professor Busnaina has obtained numerous awards and honors in his time in the industry, as well as being a widely published author. He also occupies a position of leadership at the Northeastern University Center for High-rate nanomanufacturing. 


Related Faculty: Ahmed Busnaina

Related Departments:Mechanical & Industrial Engineering