Depositing Colloidal Particles onto Substrates

MIE Professor Ahmed Busnaina was awarded a patent for developing an “Interfacial convective assembly for high aspect ratio structures without surface treatment”.

Abstract Source: USPTO

A method for assembling colloidal particles onto a substrate surface through fluid transport. The method comprises placing a first fluid placed adjacent to the substrate surface, applying a colloidal dispersion on top of the first fluid layer and removal of the first fluid layer. The method is extremely versatile, and is especially useful in depositing colloidal materials in high aspect ratio channels and vias without the need for prior treatment of the surface.

Related Faculty: Ahmed Busnaina

Related Departments:Mechanical & Industrial Engineering