NanoOPS to be Showcased at TechConnect World Innovation Summit & Expo

CHN’s Nanoscale Offset Printing System (NanoOPS) will be showcased at this year’s TechConnect World Innovation Summit & Expo, June 15-17, 2015.

The TechConnect World Innovation Conference is an annual event uniquely designed to accelerate the commercialization of innovations out of the lab and into industry. The Technical Program spotlights applications focused innovations, materials and devices emerging from industrial, government and academic laboratories worldwide. The Innovation Partnering Program gathers market-ready, commercially-viable, innovations into the largest global technology accelerator program.

Related Faculty: Ahmed Busnaina

Related Departments:Mechanical & Industrial Engineering