News
Jul 10, 2019
Preparing for "The Big One"
CEE Professor and Chair Jerome Hajjar is pushing to improve building codes across the country to withstand natural disasters like last week’s two earthquakes in California.
Jul 10, 2019
Improving Protein Measuring Technology
Bioengineering Assistant Professor Nikolai Slavov has developed a breakthrough method of identifying more than a thousand proteins per cell which could help map the functions of them throughout the body.
Jul 10, 2019
Prof. Ed Goluch to give invited Plenary Talk at AIChe Annual Meeting this Fall
ChE Associate Professor Ed Goluch has been invited to give a Plenary Talk at the 2019 American Institute of Chemical Engineers (AIChE) conference in November on “Electrochemical Sensors for Multiplexed Infection Detection and Monitoring”.
Jul 08, 2019
Fu Awarded Patent to Digitally Remove Makeup from an Image
ECE/Koury Professor Yun “Raymond” Fu was awarded a patent for creating a “system for beauty, cosmetic, and fashion analysis.”
Jul 08, 2019
Exploring New Territories in HPC Job Scheduling
ECE Assistant Professor Devesh Tiwari was awarded a $500K NSF grant for “REYAZ: Reliability-Aware Job Scheduling for HPC Systems.”
Jul 03, 2019
Prof. Adam Ekenseair and PhD student Ninad Kanetkar contribute to a new book
Chemical Engineering Assistant Professor Adam Ekenseair and PhD Student Ninad Kanetkar contributed a book chapter in the newly published book Handbook of Tissue Engineering Scaffolds: Volume Two 1st edition.
Jul 02, 2019
Cheryl Arruda Joins Civil and Environmental Engineering Co-Op Team
The Department of Civil and Environmental Engineering (CEE) welcomes Cheryl Arruda (above right), to join its co-op team alongside Assistant Co-op Coordinator Jessica Ormsby (left). She will join the CEE […]
Jul 01, 2019
NSF Award for Roll-to-Roll Printing of Multi-layer Flexible Substrate Electronics
MIE Assistant Professors Xiaoning “Sarah” Jin and Hongli Zhu were awarded a $544K NSF grant for “Manufacturing USA: Precision Alignment of Roll-to-Roll Printing of Flexible Paper Electronics Through Modeling and Virtual Sensor-based Control.”