Teiichi Ando

Professor,  Mechanical and Industrial Engineering

Contact

Office

  • 249 SN
  • 617.373.3811

Lab

  • 157A-C Egan
  • 617.373.2253

Research Focus

Rapid solidification processing, droplet-based materials processing, powder metallurgy, material processing by severe plastic deformation, processing-structure-property relationships in materials

Education

  • PhD (1982), Metallurgy, Colorado School of Mines

Honors & Awards

  • Fellow of ASM International (2009)
  • Søren Buus Outstanding Research Award, COE, Northeastern University (2005)
  • R&D 100 Award for the project “Enhancement of Aluminum Forgings by High-Density Infrared Radiant heating” (2004)

Teaching Interests

  • Thermodynamics of materials
  • Phase transformation kinetics
  • Solidification processing

Professional Affiliations

  • American Ceramic Society
  • American Institute of Powder Metallurgy
  • American Society for Metals International (Fellow)
  • The Association for Iron and Steel Technology
  • Materials Research Society
  • The Minerals, Metals and Materials Society
  • Sigma Xi

Research Overview

Rapid solidification processing, droplet-based materials processing, powder metallurgy, material processing by severe plastic deformation, processing-structure-property relationships in materials

Advanced Materials Processing Lab

Our research at AMPL addresses two important areas of materials processing: rapid solidification processing and severe plastic deformation processing. Specific processes investigated in our lab include the uniform-droplet spray (UDS) process, equal-channel angular pressing (ECAP), ultrasonic powder consolidation (UPC) and gas dynamic cold spray (GDCS). The UDS process is a controlled capillary laminar-jet breakup process that can generate sprays of mono-disperse alloy droplets. We use this process to study the in-flight solidification of alloy droplets and to produce particulate materials and spray deposits with novel microstructures.

Advanced Materials Processing Lab

Selected Research Projects

  • Fabrication of High-Thermal Conductivity, Low Thermal Expansivity Cu-Invar and Cu-Graphite Composites by Ultrasonic Powder Consolidation
    • – Principal Investigator, Hitachi Metals, Ltd
  • Engineered Materials and Materials Design of Engineered Materials
    • – Co-Principal Investigator, Army Research Laboratory

Selected Publications

  • W.C, Evans, X. Dan, A. Houshmand, S. Muftu, T. Ando Microstructural Characterization of 6061 Aluminum Splat Deposited on T6 3061 Aluminum Substrate, Metallurgical and Materials Transactions A, 50A (8), 2019, 3937-3948
  • T. Ando, A. Houshmand, Dislocation Climb Rate at Very High Vacancy Concentrations, Materialia, 8, 2019, 100472
  • Z. Huang, K. Date, K. Tatsugawa, T. Ando Characterization of Al Skeletal Structures Fabricated by Ultrasonic Powder Consolidation, Metallurgical and Materials Transactions A, 49A, 2018, 6173-6183
  • Y. Li, Y. Hamada, K. Otobe, T. Ando, A Method to Predict the Thickness of Poor-Bonded Material along Spray and Spray-Layer Boundaries in Cold Spray Deposition, J. Thermal Spray Technology, 26(3), 2017, 350-359
  • S. Onell, T. Ando, Application of a Simple Sub-Regular Solution Model to the Computation of Phase Boundaries and Free-Dendritic Growth in the Ag-Cu System, Acta Mater, 113, 2016, 109-115
  • Y. Shu, S. Gheybi Hashemabad, T. Ando, Z. Gu Ultrasonic Powder Consolidation of Sn/In Nanosolder Particles and Their Application for Low Temperature Cu- Cu Joining, Materials and Design, 111, 2016, 631-639

Jul 07, 2015

Heating at the Nanoscale

MIE Professor Teiichi Ando was awarded a patent for creating a nanoscale heater element capable of local selectivity and controlled exposure.

Aug 02, 2011

Strength of Particle Bonds

MIE Assistant Professor Andrew Gouldstone and Professors Teiicho Ando & Sinan Muftu were awarded a $400K NSF grant to determine how the bonding of particles is affected by ultrasonic vibrations.

Sep 22, 2010

Joining at the Microscale

MIE Professor Teiichi Ando has been awarded a $137K NSF grant to join materials together at the microscale using nanoheater structures leading to new ways to build microscale devices.

Jun 26, 2009

Prof Ando Selected as Fellow

Mechanical and Industrial Engineering Professor Teiichi Ando has been selected as a Fellow of ASM International.

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